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Abstract

Vibration-assisted drilling (VAD) of Ti6Al4V is typically used in the aerospace industry to enhance the performance of the machining process. A mix of continuous and saw-tooth chip formation is associated with VAD of Ti6Al4V. In this paper, a comprehensive experimental study is developed to examine the effect of process parameters on the dominant chip formation mechanisms and the associated effects on the thrust forces and machined surface finish. The results indicate a significant change of the chips free surface produced by VAD. The kinematics of VAD showed a direct relation between the VAD amplitude and the effective rake angle. In agreement with the theory of saw-tooth formation due to cyclic crack formation, the scanning electron microscopy (SEM) examination showed a gross crack (GC) and micro crack (MC) along the shear plane. The GC increased from 20 μm for conventional drilling to 224 μm for VAD at the highest amplitude. Moreover, increasing the VAD amplitude to 160 μm showed an obvious enhancement of the machined surface finish. In addition, the study presents the influence of VAD on the tool wear mechanisms through the composition analysis of the chips machined surface using Energy Dispersion X-ray Spectroscopy (EDS).

Details

Title
Effect of process parameters on chip formation during vibration-assisted drilling of Ti6Al4V
Author
Hussein, R 1   VIAFID ORCID Logo  ; Sadek, A 2 ; Elbestawi, M A 1 ; Attia, M H 2 

 McMaster University, Department of Mechanical Engineering, Hamilton, Canada (GRID:grid.25073.33) (ISNI:0000 0004 1936 8227) 
 National Research Council Canada, Aerospace Manufacturing, QC, Canada (GRID:grid.24433.32) (ISNI:0000 0004 0449 7958) 
Pages
1105-1119
Publication year
2020
Publication date
Feb 2020
Publisher
Springer Nature B.V.
ISSN
02683768
e-ISSN
14333015
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2343358474
Copyright
The International Journal of Advanced Manufacturing Technology is a copyright of Springer, (2019). All Rights Reserved.