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© 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

In this study, lignin has been extracted from oil palm empty fruit bunch (EFB) fibers via an organosolv process. The organosolv lignin obtained was defined by the presence of hydroxyl-containing molecules, such as guaiacyl and syringyl, and by the presence of phenolic molecules in lignin. Subsequently, the extracted organosolv lignin and graphene nanoplatelets (GNP) were utilized as filler and reinforcement in photo-curable polyurethane (PU), which is used in stereolithography 3D printing. The compatibility as well as the characteristic and structural changes of the composite were identified through the mechanical properties of the 3D-printed composites. Furthermore, the tensile strength of the composited lignin and graphene shows significant improvement as high as 27%. The hardness of the photo-curable PU composites measured by nanoindentation exhibited an enormous improvement for 0.6% of lignin-graphene at 92.49 MPa with 238% increment when compared with unmodified PU.

Details

Title
Evaluation of the Compatibility of Organosolv Lignin-Graphene Nanoplatelets with Photo-Curable Polyurethane in Stereolithography 3D Printing
Author
Ibrahim, Fathirrahman 1 ; Mohan, Denesh 1   VIAFID ORCID Logo  ; Sajab, Mohd Shaiful 1   VIAFID ORCID Logo  ; Saiful Bahari Bakarudin 2 ; Kaco, Hatika 3 

 Research Center for Sustainable Process Technology (CESPRO), Faculty of Engineering and Built Environment, Universiti Kebangsaan Malaysia, Bangi 43600, Selangor, Malaysia; [email protected] (F.I.); [email protected] (D.M.); Chemical Engineering Programme, Faculty of Engineering and Built Environment, Universiti Kebangsaan Malaysia, Bangi 43600, Selangor, Malaysia 
 Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, Bangi 43600, Selangor, Malaysia; [email protected] 
 Kolej GENIUS Insan, Universiti Sains Islam Malaysia, Bandar Baru Nilai, Nilai 71800, Negeri Sembilan, Malaysia; [email protected] 
First page
1544
Publication year
2019
Publication date
2019
Publisher
MDPI AG
e-ISSN
20734360
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2557235701
Copyright
© 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.