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Copyright © 2018 Heijun Jeong et al. This is an open access article distributed under the Creative Commons Attribution License (the “License”), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. http://creativecommons.org/licenses/by/4.0/

Abstract

In this paper, we propose a frequency-tunable electromagnetic absorber that uses the mechanical control of substrate thickness. The absorption frequency of the proposed absorber can be changed by varying the substrate thickness. In order to mechanically control the substrate thickness, we introduce a 3D-printed molding with air space. The proposed structure consists of two layers and one frame: the FR4 substrate, polylactic acid (PLA) frame, and air substrate. The FR4 and PLA thicknesses are fixed, and the air thickness is varied using the PLA frame. Therefore, the effective dielectric constant of the overall substrate can be changed. The metallic rectangular patch and ground are patterned on the top and bottom FR4 substrates, respectively. The performance of the proposed tunable absorber is demonstrated from full-wave simulation and measurements. When both of the FR4 substrate thicknesses are 0.3 mm and the air thickness is changed from 1 to 3.5 mm, the absorption frequency is changed from 8.9 to 8.0 GHz, respectively. Therefore, the frequency-tuning capability of the proposed absorber is successfully demonstrated.

Details

Title
Frequency-Tunable Electromagnetic Absorber by Mechanically Controlling Substrate Thickness
Author
Jeong, Heijun 1 ; Tentzeris, Manos M 2   VIAFID ORCID Logo  ; Lim, Sungjoon 1   VIAFID ORCID Logo 

 School of Electrical and Electronics Engineering, College of Engineering, Chung-Ang University, Seoul 156-756, Republic of Korea 
 School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250, USA 
Editor
Atsushi Mase
Publication year
2018
Publication date
2018
Publisher
John Wiley & Sons, Inc.
ISSN
16875869
e-ISSN
16875877
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2101213078
Copyright
Copyright © 2018 Heijun Jeong et al. This is an open access article distributed under the Creative Commons Attribution License (the “License”), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. http://creativecommons.org/licenses/by/4.0/