Full Text

Turn on search term navigation

© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Open circuit failure mode in insulated-gate bipolar transistors (IGBT) is one of the most common faults in modular multilevel converters (MMCs). Several techniques for MMC fault diagnosis based on threshold parameters have been proposed, but very few studies have considered artificial intelligence (AI) techniques. Using thresholds has the difficulty of selecting suitable threshold values for different operating conditions. In addition, very little attention has been paid to the importance of developing fast and accurate techniques for the real-life application of open-circuit failures of IGBT fault diagnosis. To achieve high classification accuracy and reduced computation time, a fault diagnosis framework with a combination of the AC-side three-phase current, and the upper and lower bridges’ currents of the MMCs to automatically classify health conditions of MMCs is proposed. In this framework, the principal component analysis (PCA) is used for feature extraction. Then, two classification algorithms—multiclass support vector machine (SVM) based on error-correcting output codes (ECOC) and multinomial logistic regression (MLR)—are used for classification. The effectiveness of the proposed framework is validated by a two-terminal simulation model of the MMC-high-voltage direct current (HVDC) transmission power system using PSCAD/EMTDC software. The simulation results demonstrate that the proposed framework is highly effective in diagnosing the health conditions of MMCs compared to recently published results.

Details

Title
Intelligent Fault Diagnosis Framework for Modular Multilevel Converters in HVDC Transmission
Author
Ahmed, Hosameldin O A 1 ; Yu, Yuexiao 2 ; Wang, Qinghua 3 ; Darwish, Mohamed 1 ; Nandi, Asoke K 4   VIAFID ORCID Logo 

 Department of Electronic and Electrical Engineering, Brunel University London, Uxbridge UB8 3PH, UK; [email protected] (H.O.A.A.); [email protected] (Y.Y.); [email protected] (Q.W.); [email protected] (M.D.) 
 Department of Electronic and Electrical Engineering, Brunel University London, Uxbridge UB8 3PH, UK; [email protected] (H.O.A.A.); [email protected] (Y.Y.); [email protected] (Q.W.); [email protected] (M.D.); State Grid Sichuan Electric Power Research Institute of China, Chengdu 610094, China 
 Department of Electronic and Electrical Engineering, Brunel University London, Uxbridge UB8 3PH, UK; [email protected] (H.O.A.A.); [email protected] (Y.Y.); [email protected] (Q.W.); [email protected] (M.D.); School of Mechatronic Engineering, Xi’an Technological University, Xi’an 710021, China 
 Department of Electronic and Electrical Engineering, Brunel University London, Uxbridge UB8 3PH, UK; [email protected] (H.O.A.A.); [email protected] (Y.Y.); [email protected] (Q.W.); [email protected] (M.D.); Visiting Professor, School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, China 
First page
362
Publication year
2022
Publication date
2022
Publisher
MDPI AG
e-ISSN
14248220
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2618265271
Copyright
© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.