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Introduction
When addressing the reliability of electronic packaging, most of recent research papers focus on the study of solder joints under thermal loads. Among many references, [1] Tavernelli and Coffin (1962), [2] Wild (1972), [3] Akay et al. (1977), [4] Frear et al. (1990), [5] Lau et al. (1994), [6] Hwang (1996), [7] Chan and Tay (2005), [8] Tee et al. (2005) and [9] Tee and Zhong (2004) have a good collection of materials on this subject. An empirical model or equation is based on design experience or test experience and is generally not based completely on the physics of the problem. Probably the best-known empirical model to estimate component life under vibration is Steinberg's model ([10], [11] Steinberg (1988, 2001), he revised this book twice). His approach was based on his testing and experience, and not on any kind of stress analysis. [12] Marinis et al. (1984) followed Steinberg's empirical model quite closely and illustrated how it could be used to design an electronic system to survive a high vibration and shock environment. [13] Sloan (1985) presented a relatively comprehensive review of the calculations needed for the design of electronic equipment able to survive in various environments, including shock and vibration. His design calculations were typically discussed in terms of simple dynamics and strength of materials concepts. [14], [15] Barker et al. (1992, 1994) and [16] Wu (2009) proposed some analytical methods to estimate the vibration fatigue life of leaded surface mount components and discussed the assumptions and details of the fatigue life calculations required to predict the fatigue life of quad leaded surface mount components operating in a vibration environment and also presented that it does not require complex finite element modeling, nor does it reduce the problem to a simple empirical equation. [17] Roberts and Stillo (1991) used a finite element model to analyze the vibration fatigue in ceramic capacitor leads under random vibration. In their analysis, however, only a specific printed circuit board (PCB) and an assumed dynamic random excitation were considered; therefore, their final results are only applicable to this specific PCB and this random excitation. [18] Pitarresi and Akanda (1994) reported experimental and finite element analysis (FEA) modeling work to characterize the natural frequencies, mode shape, transmissibility and...