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© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

The development of capacitive pressure sensors with low cost, high sensitivity and facile fabrication techniques is desirable for flexible electronics and wearable devices. In this project, a highly sensitive and flexible capacitive pressure sensor was fabricated by sandwiching a porous PAP sponge dielectric layer between two copper electrodes. The porous PAP sponge dielectric layer was fabricated by introducing highly conductive silver nanowires (AgNWs) into the PDMS sponge with 100% sucrose as a template and with a layer of polydimethylsiloxane (PDMS) film coating the surface. The sensitivity of the PAP sponge capacitive pressure sensor was optimized by increasing the load amount of AgNWs. Experimental results demonstrated that when the load amount of AgNWs increased to 150 mg in the PAP sponge, the sensitivity of the sensor was the highest in the low-pressure range of 0–1 kPa, reaching 0.62 kPa−1. At this point, the tensile strength and elongation of sponge were 1.425 MPa and 156.38%, respectively. In addition, the specific surface area of PAP sponge reached 2.0 cm2/g in the range of 0–10 nm pore size, and showed excellent waterproof performance with high elasticity, low hysteresis, light weight, and low density. Furthermore, as an application demonstration, ~110 LED lights were shown to light up when pressed onto the optimized sensor. Hence, this novel porous PAP-sponge-based capacitive pressure sensor has a wide range of potential applications in the field of wearable electronics.

Details

Title
A Novel Porous PDMS-AgNWs-PDMS (PAP)-Sponge-Based Capacitive Pressure Sensor
Author
Tan, Xueqiang; Zheng, Jimin  VIAFID ORCID Logo 
First page
1495
Publication year
2022
Publication date
2022
Publisher
MDPI AG
e-ISSN
20734360
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2653007773
Copyright
© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.