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© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Predicting the wafer material removal rate (MRR) is an important step in semiconductor manufacturing for total quality control. This work proposes a deep learning model called a fusion network to predict the MRR, in which we consider separating features into shallow and deep features and use the characteristics of deep learning to perform a fusion of these two kinds of features. In the proposed model, the deep features go through a sequence of nonlinear transformations and the goal is to learn the complex interactions among the features to obtain the deep feature embeddings. Additionally, the proposed method is flexible and can incorporate domain knowledge into the model by encoding the knowledge as shallow features. Once the learning of deep features is completed, the proposed model uses the shallow features and the learned deep feature embeddings to obtain new features for the subsequent layers. This work performs experiments on a dataset from the 2016 Prognostics and Health Management Data Challenge. The experimental results show that the proposed model outperforms the competition winner and three ensemble learning methods. The proposed method is a single model, whereas the comparison methods are ensemble models. Besides the experimental results, we conduct extensive experiments to analyze the proposed method.

Details

Title
Predicting the Wafer Material Removal Rate for Semiconductor Chemical Mechanical Polishing Using a Fusion Network
Author
Chien-Liang, Liu 1   VIAFID ORCID Logo  ; Chun-Jan Tseng 2   VIAFID ORCID Logo  ; Wen-Hoar Hsaio 3   VIAFID ORCID Logo  ; Sheng-Hao, Wu 1 ; Shu-Rong, Lu 1 

 Department of Industrial Engineering and Management, National Yang Ming Chiao Tung University, Hsinchu 300093, Taiwan 
 Department of Industrial Engineering and Management, National Yang Ming Chiao Tung University, Hsinchu 300093, Taiwan; National Defense Management Education and Training Center, Management College, National Defense University, Taipei 112305, Taiwan 
 Department of Computer Science and Information Engineering, Nanya Institute of Technology, Taoyuan 320678, Taiwan 
First page
11478
Publication year
2022
Publication date
2022
Publisher
MDPI AG
e-ISSN
20763417
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2739421706
Copyright
© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.