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© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

The deformation problem caused by the excessive residual stress has brought great challenges to the high-precision machining and geometrical stability of thin-walled components. Aiming to ensure the verticality within 0.012 mm after the processing and forming of a certain type of outer ring components, this paper firstly employs the ultrasonic critical refraction longitudinal wave (LCR wave) detection method to test the residual stress distribution in the key process. Additionally, the stress elimination effect of cryogenic stress relief treatment and the effect of residual stress on vertical deformation are analyzed. After that, combined with the self-developed ultrasonic stress relief (USR) equipment, the ultrasonic regulation treatment was used to replace the heat treatment stress relief process for the processing. The results show that after wire cutting and milling, excessive residual stress induces deformation of components, and USR method can eliminate machining residual stress more efficiently and quickly. As the whole component has torsional deformation along the cross section, the hole position at the upper and lower end faces is changed, which leads to the change in verticality. Finally, based on the results of X-ray diffraction (XRD), the potential microscopic mechanism of stress relief by ultrasonic treatment is analyzed. This study provides guidance for ultrasonic residual stress regulation to achieve the high-precision outer ring thin-walled components.

Details

Title
The Residual Stress and Deformation Control of TC4 Thin-Walled Outer Ring Components by Ultrasonic Regulation
Author
Wen-Yuan, Song 1 ; Chun-Guang Xu 1 ; Qin-Xue, Pan 1   VIAFID ORCID Logo  ; Pei-Lu, Li 1 ; Wang, Lei 2 ; Yu, Tao 2 

 School of Mechanical Engineering, Beijing Institute of Technology, Beijing 100081, China; [email protected] (W.-Y.S.); [email protected] (C.-G.X.); [email protected] (P.-L.L.) 
 Xi’an Electronic Engineering Research Institute, Xi’an 710100, China; [email protected] (L.W.); [email protected] (T.Y.) 
First page
598
Publication year
2022
Publication date
2022
Publisher
MDPI AG
e-ISSN
20751702
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2706281307
Copyright
© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.