Full Text

Turn on search term navigation

© 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Impedance mismatch that degrades signal power transfer and affects communication reliability is a major obstacle for power line communications (PLC). Impedance matching techniques can be designed to effectively compensate for the impedance mismatch between PLC modems and power line networks at a specific frequency or for a given frequency band. In this paper, we discuss the tradeoffs that need to be made when designing an effective impedance matching network. We also make a comprehensive review of previous state-of-the-art PLC impedance matching techniques and provide a useful classification of each technique. Finally, we discuss important issues (concerns) and provide suggestions for research directions deserving more attention. This review provides a useful guideline for researchers and manufacturers to quickly understand impedance matching principles and facilitate the design of an effective impedance matching coupler for PLC applications.

Details

Title
A Review of Impedance Matching Techniques in Power Line Communications
Author
Wang, Bingting 1   VIAFID ORCID Logo  ; Cao, Ziping 2 

 College of Telecommunications & Information Engineering, Nanjing University of Posts and Telecommunications, Nanjing 210003, China; College of Mechanical and Electrical Engineering, Chuzhou University, Chuzhou 239000, China; [email protected] 
 College of Telecommunications & Information Engineering, Nanjing University of Posts and Telecommunications, Nanjing 210003, China 
First page
1022
Publication year
2019
Publication date
2019
Publisher
MDPI AG
e-ISSN
20799292
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2548429976
Copyright
© 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.