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© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

In this review, the conservation methods for various types of cultural relics enabled by hyperspectral imaging are summarized, and the hyperspectral cameras and techniques utilized in the process from data acquisition to analyzation are introduced. Hyperspectral imaging is characterized by non-contact detection, broadband, and high resolution, which are of great significance to the non-destructive investigation of cultural relics. However, owing to the wide variety of cultural relics, the utilized equipment and methods vary greatly in the investigations of the associated conservation. Previous studies generally select a single type of cultural relic for conservation. That is, seldom study has focused on the application of hyperspectral techniques to generalized conservation methods that are simultaneously suitable for different types of cultural relics. Hence, some widely used hyperspectral cameras and imaging systems are introduced first. Subsequently, according to the previous investigations, the methods used for image acquisition, image correction, and data dimensionality reduction in hyperspectral techniques are described. Thirdly, a summary of methods in cultural relic conservation based on hyperspectral techniques is presented, which involves pigments, grottoes and murals, and painting and calligraphy. Later, some challenges and potential development prospects in hyperspectral-based methods are discussed for future study. Finally, the conclusions are given.

Details

Title
Review on Analysis Methods Enabled by Hyperspectral Imaging for Cultural Relic Conservation
Author
Pei, Zhongming 1 ; Yong Mao Huang 1   VIAFID ORCID Logo  ; Zhou, Ting 2 

 School of Electrical and Electronic Information, Xihua University, Chengdu 610039, China[email protected] (Y.M.H.) 
 Department of Science and Technology, Xihua University, Chengdu 610039, China 
First page
1104
Publication year
2023
Publication date
2023
Publisher
MDPI AG
e-ISSN
23046732
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2882601431
Copyright
© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.