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© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Currently, silver nanoparticles have attracted large interest in the photonics, electrics, analytical, and antimicrobial/biocidal fields due to their excellent optical, electrical, biological, and antibacterial properties. The versatility in generating different sizes, shapes, and surface morphologies results in a wide range of applications of silver nanoparticles in various industrial and health-related areas. In industrial applications, silver nanoparticles are used to produce conductive inks, which allows the construction of electronic devices on low-cost and flexible substrates by using various printing techniques. In order to achieve successful printed patterns, the necessary formulation and synthesis need to be engineered to fulfil the printing technique requirements. Additional sintering processes are typically further required to remove the added polymers, which are used to produce the desired adherence, viscosity, and reliable performance. This contribution presents a review of the synthesis of silver nanoparticles via different methods (chemical, physical and biological methods) and the application of silver nanoparticles under the electrical field. Formulation of silver inks and formation of conductive patterns by using different printing techniques (inkjet printing, screen printing and aerosol jet printing) are presented. Post-printing treatments are also discussed. A summary concerning outlooks and perspectives is presented at the end of this review.

Details

Title
Silver Nanoparticles for Conductive Inks: From Synthesis and Ink Formulation to Their Use in Printing Technologies
Author
Zhang, Junhui 1   VIAFID ORCID Logo  ; Ahmadi, Maziar 1 ; Fargas, Gemma 1   VIAFID ORCID Logo  ; Perinka, Nikola 2 ; Reguera, Javier 2   VIAFID ORCID Logo  ; Lanceros-Méndez, Senentxu 3   VIAFID ORCID Logo  ; Llanes, Luis 1   VIAFID ORCID Logo  ; Jiménez-Piqué, Emilio 1   VIAFID ORCID Logo 

 CIEFMA-Departament de Ciència i Enginyeria de Materials, Campus Diagonal Besòs (EEBE), Universitat Politècnica de Catalunya, C/Eduard Maristany, 10-14, Building I, 1st Floor, 08019 Barcelona, Spain; [email protected] (J.Z.); [email protected] (M.A.); [email protected] (E.J.-P.); Barcelona Research Center for Multiscale Science and Engineering, Campus Diagonal Besòs (EEBE), Universitat Politècnica de Catalunya, C/Eduard Maristany, 10-14, Building I, Basement Floor, 08019 Barcelona, Spain 
 BCMaterials, Basque Center for Materials, Applications, and Nanostructures, UPV/EHU Science Park, 48940 Leioa, Spain; [email protected] (N.P.); [email protected] (J.R.); [email protected] (S.L.-M.) 
 BCMaterials, Basque Center for Materials, Applications, and Nanostructures, UPV/EHU Science Park, 48940 Leioa, Spain; [email protected] (N.P.); [email protected] (J.R.); [email protected] (S.L.-M.); IKERBASQUE, Basque Foundation for Science, 48009 Bilbao, Spain 
First page
234
Publication year
2022
Publication date
2022
Publisher
MDPI AG
e-ISSN
20754701
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2632995362
Copyright
© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.