Abstract

Every year, at least 100 million tons of solid waste globally comes from packaging waste, in which partly created by inefficient packaging. Multiple box arrangement or bin packing solution directly addresses this problem which also affects storing space in production, manufacturing and logistics sector. Smart packing algorithm is designed for solving three-dimensional bin/container packing problem (3DBPP) which has numerous practical applications in various fields including container ship loading, pallet loading, plane cargo, warehouse management and parcel packing. This project investigates the implementation of genetic algorithm (GA) for a smart packing simulator in solving the 3DBPP applications. The smart packing system has an adaptable chromosome length GA for more robust implementation, where chromosome length will be changing with number of boxes. It can optimize multiple box arrangements and the boxes movements and positions are simulated through each GA generations, for realistic adaptation. The system is able to make optimum arrangement for the boxes so they can fit into a smallest container possible. The time taken for GA to converge varies with number of boxes.

Details

Title
Smart Packing Simulator for 3D Packing Problem Using Genetic Algorithm
Author
Khairuddin, U 1 ; N A Z M Razi 2 ; Abidin, M S Z 3 ; Yusof, R 4 

 Department of Mechanical Precision Engineering, Malaysia-Japan International Institute of Technology, Universiti Teknologi Malaysia, 54100 Kuala Lumpur, Malaysia; Centre for Artificial Intelligence & Robotics, Malaysia-Japan International Institute of Technology, Universiti Teknologi Malaysia, 54100 Kuala Lumpur, Malaysia 
 Department of Mechanical Precision Engineering, Malaysia-Japan International Institute of Technology, Universiti Teknologi Malaysia, 54100 Kuala Lumpur, Malaysia 
 Department of Information Systems, Faculty of Computer and Mathematical Sciences, Universiti Teknologi MARA, 42300 Shah Alam, Selangor, Malaysia 
 Centre for Artificial Intelligence & Robotics, Malaysia-Japan International Institute of Technology, Universiti Teknologi Malaysia, 54100 Kuala Lumpur, Malaysia 
Publication year
2020
Publication date
Jan 2020
Publisher
IOP Publishing
ISSN
17426588
e-ISSN
17426596
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2569096274
Copyright
© 2020. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.