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As the Year of the Engineer and of our 25th anniversary celebration winds to a close, we think it appropriate to reflect on the industry achievements of the past year and venture some predictions about the future. In this special report, our editors take you on a journey from the bottom of the electronics "food chain"-advanced materials (page 42)-through to the implementation of those materials in the latest packaging technologies (page 86). In between, we traverse the changing microprocessor landscape (page 44), explore the percolation of Java into real-world applications (page 46), look at...