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Devices would be probed at the wafer level before dicing and packaging.
NASA's Jet Propulsion Laboratory, Pasadena, California
A method of electromechanical testing has been proposed for general diagnosis, evaluation of performance, and burn-in (accelerated life testing) of microelectromechanical devices. The tests would ordinarily be performed at the wafer level; that is, after the devices have been fabricated on wafers but before the wafers have been diced and the dies packaged. Alternatively or in addition, the tests could be performed at other stages of the fabrication process.
According to this method, a probe would apply a specified mechanical and/or electrical stimulus to each device (sensor or actuator) on a wafer, and the response of the device to the stimulus would be measured. The things most likely to be useful as probes are piezoelectric transducers because they are easy to use, rugged,...