Content area
Full text
Industry volunteers continued their standards development work at meetings held in conjunction with Electronics Midwest 2010.
Printed Board Design
The IPC 1-10c Test Coupon and Artwork Generation Task Group reviewed a future addendum to IPC-2221A, Generic Standard on Printed Board Design, which will present an "overhaul" of existing test coupon designs in section 12.4 of IPC-2221A. A new A/B-R plated-through-hole evaluation coupon design was approved as a replacement for the legacy A and B and A/B test coupon designs. The group also reviewed proposed design changes for the "D" interconnect resistance coupon, the "E" insulation resistance coupon, the "S" plated-hole solderability test coupon, and a new "P" peel-strength evaluation coupon.
Base Materials
The 3-11 Laminate/Prepreg Materials Subcommittee continued its work on Amendment 1 to IPC-4101C, Specification for Base Materials for Rigid and Mulitlayer Printed Boards. Their meeting covered: inclusion of DMA testing for Tg measurement along with DSC and TMA testing; rationalization (consolidation) of specification sheets; continued support of using another optional metric for laminate/prepreg resin, termed fracture toughness; agreement to include a new polyimide specification sheet; and the potential UL reclassification of numerous FR-4 systems.
The 3-11g Corrosion of Metal Finishes Task Group reviewed the proposed creep corrosion test plan using mixed flowing gas (MFG) to accelerate corrosion formation. Group is seeking another company to participate as a tester on the MFG method.
The 3-12a Metallic Foil Task Group discussed the statistical results of non-contact copper foil surface roughness measurements. Further testing and analysis will...