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A leading advanced packaging equipment provider, NEXX Systems (NEXX) sold a 300mm Stratus electrochemical deposition (ECD) system to Powertech Technology (PTI), a major IC packaging and testing company headquartered in Taiwan. The Stratus will be used for copper pillar bumps and re-distribution layers in advanced packaging applications that enable portable intelligent devices, such as smart phones and tablet PCs. The Stratus platform is also being evaluated as part of PTI's aggressive TSV commercialization program. Recently, PTI has...