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As TechSearch International predicted last year, increased demand in 2005 resulted in longer delivery times and price increases for laminate flip chip build-up substrates. While several companies have added capacity since 2005, the situation is expected to remain much the same through the end of this year. One reason is that installed capacity requires time for qualification before substrates can be shipped for production. Approximately 25 weeks or longer are needed for completion of engineering evaluation and qualification. The 25-week estimate is based on incoming engineering evaluation (2 weeks), engineering build (8 weeks), and actual qualification testing (15 weeks). However, the situation should improve in 2007 and 2008 as additional capacity is installed and qualified. As part of its analysis, TechSearch International interviewed two dozen laminate substrate suppliers to determine production capacity for build-up FC-PBGA, wire bond PBGA, and laminate CSP substrates. Additional details are available in TechSearch International's Advanced Packaging Update: Market and Technology Trends.