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Circuitree solicited details from companies that supply alternatives to oxide bonding. While the following list is not comprehensive, we hope it provides valuable information for fabricators resear(:hing this subject
AlphaPREP(TradeMark)-The Black Oxide Alternative (Enthone)
The AlphaPREP(TradeMark) process is an alternative treatment of copper, specifically formulated to replace the conventional Black Oxide operation. PC-7023/PC-7023 NCC (Patent # 5,800,85) is the main product used in the AlphaPREP process scheme. This Peroxy/ Sulfuric mixture in addition to some unique additives, forms an Organo-Metallic coating, highly suitable for prepreg to copper adhesion. This coating, rich in Cuprous Oxide, is resistant to chemical attack, therefore eliminating pink ring. Additionally, the AlphaPREP process renders a superior bond strength that tolerates extreme temperature and environmental conditions with various prepreg systems, G-Tek, BT & CE to name a few.
AlphaPREP PC-7023 was developed in early 1995. The preliminary developmental work and Beta site testing were completed by early 1997. The first production installations occurred in 1997. AlphaPREP is the oldest generation oxide alternative of its kind with presently over 90 customers worldwide. This process is being utilized in dip, spray and flood immersion applications. Additionally, all AlphaPREP products are offered in a premix packaging, inclusive of all necessary ingredients. This feature eliminates mixing of various components for bath make up and subsequent replenishing. Enthone is the only supplier offering this unique packaging option.
AlphaPREP second-generation oxide alternafive, PC-7025 was developed in early 2000, and is currently being run in some of the largest PWB manufacturers' facilities. PC-7025 was primarily developed to offer the following advantages: a completely sludgeless formulation, no pre-dip step, high copper loading, and high peels & T-260.
This product is a direct replacement for PC7023 and is also offered in a premix packaging. CO-BRA Bond(TradeMark) Interlayer Adhesion Promotion System (Electrochemicals)
Electrochemicals' CO-BRA Bond process creates outstanding interlaminar bond strengths on high performance resin systems. This is achieved by combining controlled depth etching of copper with an adhesion promoter. The interlaminar bond strength is made possible through mechanical (controlled depth etching) and chemical...