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Texas Instruments (TI) is to press ahead with a capacity expansion at its 300mm DMOS6 fab in Dallas, Texas.
The chip-making sector is starting to tool up for an upturn based on the use of advanced sub-0.2 micro m processes, using equipment upgrades rather than completely new fabs.
Bill Aylesworth told an audience of analysts at the recent Prudential-Bache European Semiconductor Conference that TI plans to almost double the number of wafer starts at DMOS6 from 5700 a month at the moment to 10,000 by...