Transitioning to 450 mm Wafers

Abstract

Member companies of the International Sematech Manufacturing Initiative (ISMI) have reached a consensus on key concepts of a productivity improvement roadmap for moving the semiconductor industry toward 450 mm wafers. ISMI's Guiding Principles for 300 mm Prime (300P), developed during several meetings this year and initially revealed at SEMICON Europa, are designed to minimize the cost and design challenges of 450 mm wafers, which ISMI's members see as inevitable for the industry. Some current 300 mm productivity improvements will be coordinated and deployed in 300P or 450 mm fabs.