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Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, Taiwan, has extended its Open Innovation Platform(TM) with another focus on system-level design, analog/mixed-signal (AMS)/RF design and two-dimensional/three-dimensional integrated circuit (2-D/3-D IC) implementation. At the same time the company introduced the first three initiatives from the new focus.
TSMC originally launched the Open Innovation Platform in 2008 as an industry-wide design enablement initiative. To date, the Open Innovation platform has accelerated time-to-market, improved return on design investment and reduced design infrastructure duplication. It includes a set of interoperable ecosystem interfaces, collaborative components and design flows that efficiently empower innovation throughout the supply chain thereby enabling creation and sharing of newly-created revenue and profitability. For example, iPDK, iDRC, iLVS, iRCX, Digital Reference Flow, Integrated Signoff Flow and RF Reference Design Kit are all in production use today.
"TSMC's Open Innovation Platform delivers comprehensive and innovative design technology services that remove advanced technology adoption barriers. It helps lower design costs and improves time-to-market," said Dr Fu-Chieh Hsu, Vice President of Design Technology Platform and Deputy Head of Research & Development. "The Open Innovation Platform will now begin addressing system-level design's cost and complexity and enable packaging of entire electronic systems onto multi-chip packages."
Open Innovation Platform Roadmap Update
The Open Innovation Platform will extend beyond power, performance and area considerations (PPA) and interoperability initiatives to feature new collaborative ecosystem programs that focus on electronic-system level (ESL) design, virtual platforms and...